DFSX claims an HBM-free AI chip with double NVIDIA's system bandwidth on 14nm
Dongfang Suanxin stacks DRAM directly on top of the compute die with 3D hybrid bonding, so its chips need no HBM, the memory hardest for Chinese firms to obtain under export controls. The company claims a TY64 SuperNode built from 14nm DF2000 chips delivers 960 TB/s of memory bandwidth against 576 TB/s for NVIDIA's GB200 NVL72. The numbers are self-reported and unverified.